| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for avoiding the deformation of a plate body when using a metal substrate formed by the lamination of a plurality of kinds of layers having different compositions even if a thermal expansion difference between the layers arises and heat is applied to the plate body during manufacturing or use. SOLUTION: A package for housing an electronic component includes a first metal substrate 5 formed by the lamination of a plurality of layers including a first metal layer and a second metal layer having a composition different from that of the first metal layer and lower rigidity than that of the first metal layer, a second metal substrate 7 disposed on the main surface of the first metal substrate and formed by the lamination of a plurality of layers including a third metal layer and a fourth metal layer having a composition different from that of the third metal layer and lower rigidity than that of the third metal layer, and a frame-shaped reinforcing member 11 so disposed on the main surface of the first metal substrate as to surround the second metal substrate where the reinforcing member having rigidity higher than at least either that of the second metal layer or that of the fourth metal layer. COPYRIGHT: (C)2011,JPO&INPIT
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