SUBSTRATE MODULE AND MANUFACTURING METHOD THEREOF

摘要

A first ACF (150a) having high connection reliability but weak surface tackiness and a second ACF (150b) having high parts-mounting capability due to having strong surface tackiness are pasted onto a bulging section (111) of a glass substrate (110) that comprises a liquid crystal module (100). Since an LSI (130) and electronic parts (150) will be mounted onto the glass substrate (110) with these ACFs disposed therebetween, high-speed mounting of electronic parts is made possible, while connection reliability is secured.