METHOD FOR FABRICATING CAPILLARY FOR BONDING WIRE AND CAPILLARY FOR BONDING WIRE BY THEREOF

摘要

PURPOSE: A capillary for bonding a wire and a manufacturing method thereof are provided to prevent the material property deterioration of a capillary by minimizing the particle separation of the capillary due to an impact in an ultrasonic cleaning process. CONSTITUTION: A capillary is ultrasonically cleaned by using distilled water or organic solvents(S1). The cleaned capillary is dried(S2). An uneven layer is formed on the surface of the dried capillary(S3). A DLC(Diamond-Like Carbon) layer is formed on the surface of the capillary with the uneven layer(S4). The thickness of the DLC layer is 200 to 250 nm.