SEMICONDUCTOR DEVICE

摘要

PURPOSE: A semiconductor device is provided to alleviate the thermal stress generated from the semiconductor device by forming the stress alleviating member between the insulation substrate and the heat sink. CONSTITUTION: An insulating substrate(13) comprises a first surface(13a) and a second surface(13b) facing the first surface. A metal wiring layer(14) is bonded on the first surface of the insulation substrate. A semiconductor element(12) is boned to the metal wiring layer. A heat sink(16) is arranged on the second surface of the insulating substrate.