PRINTED CIRCUIT BOARD HAVING STRUCTURE FOR FINE PITCH AND METHOD FOR MANUFACTURING SAME

摘要

PURPOSE: A printed circuit board with a fine pitch structure and a manufacturing method thereof are provided to implement a fine pitch without a bump bridge and reduce manufacturing costs by replacing a metal mask with a film mask. CONSTITUTION: A plurality of metal pads(220) are formed on an insulation substrate(210) to expose the upper side of the metal pads. An insulation layer(230) insulates a space between the metal pads. A bump is formed on the upper side of the exposed metal pad. The upper width of the bump is narrower than the lower width of the bump.