| 摘要 |
A sealable module comprises a housing and a heat transfer device which defines a first volume. An electronic component (68, 69) is housed in a first volume 66 and immersed in a first cooling liquid. A heat transfer plate 71 closes the first volume and preferably provides a number of fins or pins 76 that intrude into the first volume. A base unit (22) is attached to the heat transfer plate and comprises a number of channels or ducts through which a second cooling flows. In use the component heats the first liquid which in turns heats the heat transfer plate. The second cooling fluid then removes heat from the base plate. In one embodiment the second fluid is pumped to a further heat sink. The flow of the second fluid may be governed according to the temperature of a semi conductor device. The outer housing may be made of a synthetic plastics material. A membrane may also be provided between the semiconductor device and the fluid in the first volume. |
