| 摘要 |
A wafer holding process maintains a wafer (10) on a spinner table as the spinner table turns. A resin dripping process discharges drops of liquid resin (100) of a predetermined amount into the center of the processing surface of the wafer. A protection film coating process sprays air towards the outer periphery from the center of the processing surface of the wafer while the spinner table is turning to blow the resin towards the outer periphery. |
