PURPOSE: An advance probe pin is provided to test various electrode pads of a semiconductor chip by forming a separation preventing unit on a bonding unit or a stress reducing unit on a support unit. CONSTITUTION: A probe pin is composed of an upper probe pin(5A) and a lower probe pin. A matching groove(2a) is formed on both lower sides of a support unit(2) of the upper probe pin. A separation preventing unit is formed in a bonding unit(3) of the upper probe pin. The matching groove is formed on both upper sides of the support unit of the lower probe pin.
