PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve the reliability of the printed circuit board by reducing a crack and stress applied to a circuit pattern. CONSTITUTION: A seed layer(120) of a circuit pattern shape is formed on one side or both sides of an insulation substrate(110). A circuit pattern layer(140) is formed on the seed layer. The edge of the surface of the circuit pattern layer is curved or the upper side of the circuit pattern layer is flat.