发明名称 POLYAMIDE RESIN, COMPOSITION CONTAINING THE POLYAMIDE RESIN, AND MOLDED ARTICLES OF THE POLYAMIDE RESIN AND THE COMPOSITION
摘要 Disclosed is a polyamide resin which is produced by the polycondensation of (A) pentamethylenediamin, (B) terephthalic acid and/or a derivative thereof, and (C) at least one member selected from adipic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, isophthalic acid, 1,9-diaminononane, 1,10-diaminodecane, 1,12-diaminododecane,caprolactam, undecalactam,laurolactam, aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, and derivatives of these compounds. In the polyamide resin, the ratio of a repeating unit derived from the component (C) is 10 to 50 wt% (inclusive) relative to the total weight of the polymer. A solution of the polyamide resin in 98 % sulfuric acid, which contains the polyamide resin at a concentration of 0.01 g/ml, has a relative viscosity of 1.5 to 4.5 at 25°C.
申请公布号 EP2305735(A1) 申请公布日期 2011.04.06
申请号 EP20090773424 申请日期 2009.06.29
申请人 TORAY INDUSTRIES, INC. 发明人 KATO, KOYA;AKITA, MASARU;MATSUOKA, HIDEO
分类号 C08G69/00;C08K3/00;C08K9/04;C08L77/00 主分类号 C08G69/00
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