发明名称 |
Interposer, module and electronics device including the same |
摘要 |
An interposer with which the manufacturing steps are able to be simplified and which shows superior high frequency characteristics is provided. The interposer includes: a substrate having a front face and a rear face; a wiring that is formed on the front face side of the substrate and is electrically connected to a semiconductor chip; an electric device connected to the wiring; and a concave section that is formed from the rear face side of the substrate in a position corresponding to the electric device. |
申请公布号 |
EP2284888(A3) |
申请公布日期 |
2011.04.06 |
申请号 |
EP20100008048 |
申请日期 |
2010.08.02 |
申请人 |
SONY CORPORATION |
发明人 |
AKIBA, AKIRA;MITARAI, SHUN;IKEDA, KOICHI;MORITA, SHINYA |
分类号 |
H01L23/66;H01L23/14;H01L23/498;H01L23/64;H01P5/107;H01Q1/22;H01Q1/38;H01Q23/00;H05K1/14 |
主分类号 |
H01L23/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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