发明名称 ELECTRICAL BONDING DEVICE FOR TELESCOPING FLUID LINE ASSEMBLY
摘要 The present application is directed to a fluid line assembly comprising a first fluid conveying conduit, a second fluid conveying conduit, and a slip joint. The slip joint includes a first fluid conveying conduit section, a second fluid conveying conduit section positioned radially outwardly from and at least partially surrounding the first conduit section, and an electrical bonding device positioned between and contacting the first and second fluid conveying conduit sections to form an electrical path therebetween. The electrical resistance between the first and second fluid conveying conduits is generally constant during relative movement therebetween.
申请公布号 EP2304298(A2) 申请公布日期 2011.04.06
申请号 EP20090786071 申请日期 2009.07.27
申请人 EATON CORPORATION 发明人 FLYNN, WILLIAM, T.
分类号 F16L25/01;F16L27/12 主分类号 F16L25/01
代理机构 代理人
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