发明名称 Forming structures that include a relaxed or pseudo-relaxed layer on a substrate
摘要 A method for forming a structure that includes a relaxed or pseudo-relaxed layer on a substrate. The method includes the steps of growing an elastically stressed layer of semiconductor material on a donor substrate; forming a glassy layer of a viscous material on the stressed layer; removing a portion of the donor substrate to form a structure that includes the glassy layer, the stressed layer and a surface layer of donor substrate material; patterning the stressed layer; and heat treating the structure at a temperature of at least a viscosity temperature of the glassy layer to relax the stressed layer and form the relaxed or pseudo-relaxed layer of the structure.
申请公布号 US7919393(B2) 申请公布日期 2011.04.05
申请号 US20100769299 申请日期 2010.04.28
申请人 S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES 发明人 GHYSELEN BRUNO;MAZURE CARLOS;ARENE EMMANUEL
分类号 H01L21/30;H01L21/20;H01L21/324;H01L21/46;H01L21/762 主分类号 H01L21/30
代理机构 代理人
主权项
地址