发明名称 |
Method for thinning substrate and method for manufacturing circuit device |
摘要 |
A method for thinning a substrate and a method for manufacturing a circuit device which make it possible to prevent the pattern of penetrating holes of a supporting plate from being transferred to the surface of the substrate and prevent non-uniform grinding of the surface of the substrate from occurring. The supporting plate and the substrate are joined by using an adhesive layer, and a sheet is attached to the supporting plate. The surface of the supporting plate to which the sheet has been attached is mounted and fixed by attraction onto an attracting head. The surface of the semiconductor wafer on which no circuit device is formed is ground by a grinder in this state.
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申请公布号 |
US7919394(B2) |
申请公布日期 |
2011.04.05 |
申请号 |
US20060517157 |
申请日期 |
2006.09.07 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
NAKAMURA AKIHIKO;MIYANARI ATSUSHI;INAO YOSHIHIRO |
分类号 |
H01L21/30;H01L21/46 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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