发明名称 DRY ETCHBACK OF INTERCONNECT CONTACTS
摘要 A method and structure for a composite stud contact interface with a decreased contact resistance and improved reliability. A selective dry etch is used which comprises a fluorine containing gas. The contact resistance is reduced by partially dry-etching back the tungsten contact after or during the M1 RIE process. The recessed contact is then subsequently metalized during the M1 liner/plating process. The tungsten contact height is reduced after it has been fully formed.
申请公布号 KR101027172(B1) 申请公布日期 2011.04.05
申请号 KR20087002079 申请日期 2006.07.27
申请人 发明人
分类号 H01L21/768;H01L21/28;H01L23/522;H01L23/532 主分类号 H01L21/768
代理机构 代理人
主权项
地址
您可能感兴趣的专利