发明名称 |
Fabrication method for semiconductor device |
摘要 |
A semiconductor device fabrication method can improve yield of semiconductor devices and decrease (or prevent) waste of non-defective semiconductor chips. This fabrication method has a step of performing characteristic inspection after packaging a semiconductor chip every time a semiconductor chip layer is formed. The fabrication method makes another semiconductor chip layer on this semiconductor chip layer only when the inspection indicates that the semiconductor chip is a non-defective product.
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申请公布号 |
US7919336(B2) |
申请公布日期 |
2011.04.05 |
申请号 |
US20080153499 |
申请日期 |
2008.05.20 |
申请人 |
OKI SEMICONDUCTOR CO., LTD. |
发明人 |
SHIZUNO YOSHINORI |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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