DUAL-PORE STRUCTURE POLISHING PAD

摘要

PURPOSE: A polishing pad of a dual-void structure is provided to reduce defects caused by pads and increase polishing speed. CONSTITUTION: A polishing pad of a dual-void structure comprises a porous polishing layer. The porous polishing layer has a dual-void structure in a polyurethane matrix. The dual-void structure is formed of primary and secondary sets of voids. The void wall of the first set of the void has the thickness of 15~55 micron meters and storage modulus of 10~60 MPa. The second set of the void has the average size of 5~30 micron meters of void. The porous polishing layer is fixed to a polymeric film or a sheet substrate or is formed in woven or non-woven structure.