发明名称 |
Packaging method for light emitting diode module that includes fabricating frame around substrate |
摘要 |
A packaging method for light emitting diode module that includes fabricating frame around substrate, wherein the method comprises the steps of: fabricating a printed circuit layer with a plurality of staggered nodes on a substrate; fabricating a frame around the substrate; fabricating a protruding inclined pier around the bottom rim of the inner wall of the frame; fabricating a plurality of convex reflecting microstructure points on the surface of the printed circuit layer; positioning chips and wire bonding; spraying reflecting paint on the surface of the substrate and the inner wall of the frame except the chips; filling a silica gel diffusion layer formed by mixing the silica gel and the diffusion powder into the frame; and evenly coating a fluorescent glue layer formed by evenly mixing another silica gel and fluorescent powder on the silica gel diffusion layer.
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申请公布号 |
US7919339(B2) |
申请公布日期 |
2011.04.05 |
申请号 |
US20080206523 |
申请日期 |
2008.09.08 |
申请人 |
ILEDM PHOTOELECTRONICS, INC. |
发明人 |
HSU CHI-YUAN |
分类号 |
H01L33/60 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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