SET-UP APPARATUS FOR WIRE BONDING SYSTEM FOR MANUFACTURING OF SEMICONDUTOR PACKAGE
摘要
<p>PURPOSE: A setup device for a wire bonding device for manufacturing a semiconductor package is provided to prevent the oxidation of a copper wire by setting a gas nozzle at the optimum position by measuring a ball surface temperature of the copper wire according to the position of the gas nozzle. CONSTITUTION: A capillary(10) has a through hole for supplying a copper wire. An EFO wand(13) makes a ball(22) by giving an electric spark to the copper wire outputted through the capillary. A gas nozzle(14) sprays inert gas for preventing the oxidation of the copper wire on the lower side of the copper wire outputted through the capillary. A temperature measuring unit measures the ball temperature of the copper wire outputted through the capillary. A three directional fitting tube is installed in a connection hose between a first storage tank(15) and the gas nozzle.</p>
