发明名称 PRINTED CIRCUIT BOARD FOR MOUNTING LIGHT EMITTING DIODE PACKAGE
摘要 PURPOSE: A printed circuit board for mounting a light emitting diode is provided to efficiently discharge heat from the light emitting diode by combining a heat radiation pad with the rear of a substrate. CONSTITUTION: A substrate(110) has a conductive pattern for mounting and driving a light emitting diode. A first heat radiation pad(114) and a second heat radiation pad are formed with the same circular type as the substrate. An insulation pattern(118) electrically insulates the conductive pattern and the first heat radiation pad. A bonding pad(130) makes a pair around a mounting point(134). A via hole(112) transmits heat from the light emitting diode to the second heat radiation pad attached to the rear of the substrate.
申请公布号 KR20110033965(A) 申请公布日期 2011.04.04
申请号 KR20090089693 申请日期 2009.09.22
申请人 DS CO., LTD. 发明人 PARK, CHAN IK;LEE, SANG CHUL;PARK, HUENG DAE
分类号 H01L33/62;H01L33/48 主分类号 H01L33/62
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