发明名称 |
PRINTED CIRCUIT BOARD FOR MOUNTING LIGHT EMITTING DIODE PACKAGE |
摘要 |
PURPOSE: A printed circuit board for mounting a light emitting diode is provided to efficiently discharge heat from the light emitting diode by combining a heat radiation pad with the rear of a substrate. CONSTITUTION: A substrate(110) has a conductive pattern for mounting and driving a light emitting diode. A first heat radiation pad(114) and a second heat radiation pad are formed with the same circular type as the substrate. An insulation pattern(118) electrically insulates the conductive pattern and the first heat radiation pad. A bonding pad(130) makes a pair around a mounting point(134). A via hole(112) transmits heat from the light emitting diode to the second heat radiation pad attached to the rear of the substrate.
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申请公布号 |
KR20110033965(A) |
申请公布日期 |
2011.04.04 |
申请号 |
KR20090089693 |
申请日期 |
2009.09.22 |
申请人 |
DS CO., LTD. |
发明人 |
PARK, CHAN IK;LEE, SANG CHUL;PARK, HUENG DAE |
分类号 |
H01L33/62;H01L33/48 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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