| 摘要 |
PURPOSE: A thermal processing device and a cooling method are provided to remove an expensive heat exchanger for a high temperature by dropping the temperature of mixed gas by mixing cooling gas with a rising temperature with the gas for a temperature drop on the upper side of a heater exchanger. CONSTITUTION: A support unit(18) is inserted into a process container(4) and detachably moves. An opening of a manifold(10) is hermetically sealed with a cover(22). A furnace(30) for heating a semiconductor wafer is installed outside the process container. An insulation member(32) surrounds the side and ceiling of the process container. A resistance heater(34) is installed along the surfaces of the inner wall of the insulation member.
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