| 摘要 |
The device (10) has an electronic component (12) e.g. light emitting component such as LED, mounted on a support (16) i.e. electronic board. A heat transferring unit is constituted of a rod shaped heat conductor element (28) i.e. heat pipe, and a sectioned element to cool the electronic component. The support is provided with an orifice that is arranged opposite to the electronic component. A portion of heat conductor element is inserted in the orifice. The element has an end positioned opposite to the electronic component and another end projected from the support. |
