Method for filling cavity in e.g. conductor substrate with nickel to form microsystem, involves partially removing masking layer from zone to partially or completely uncover cavity, and depositing metallic material in cavity

摘要

The method involves forming a masking layer (106) on a support (100) e.g. conductor substrate, in which a cavity is formed, where the masking layer covers the support, cavity walls and cavity bottom and comprises a zone whose thickness is less than or equal to a given thickness on sides and the bottom of the cavity. The masking layer is partially removed from the zone to partially or completely uncover the cavity. A metallic material (108) is deposited in the cavity.