发明名称 PHASE SHIFT MASK, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a phase shift mask that prevents the dimension of a pattern transferred to a photoresist from changing even if the exposure frequency increases, a method of manufacturing the phase shift mask, and a method of manufacturing a semiconductor device using the phase shift mask. <P>SOLUTION: The phase shift mask includes: a substrate 2 for transmitting exposure light; a semitransparent film 3 that is disposed on the substrate 2, has a transmittance to exposure light lower than that of the substrate 2, and shifts the phase of the exposure light; and a protective film 5 that covers the surface of the semitransparent film and transmits the exposure light. The protective film 5 contains oxide of at least one element selected from the group consisting of Al, Si, Ti, Hf, Zr, Cr, Ta, Y, Ce and Ni, and nitride of Al or Si. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011065113(A) 申请公布日期 2011.03.31
申请号 JP20090218240 申请日期 2009.09.21
申请人 TOSHIBA CORP 发明人 FUKUMIZU HIROYUKI;SASAKI KENJI;ETO HIDEO
分类号 G03F1/32;G03F1/54;H01L21/027 主分类号 G03F1/32
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