| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic module which can materialize a thinner type, at low cost and with high reliability. <P>SOLUTION: The electronic module includes: a component electrically and mechanically connected to a first wiring pattern via a connection member; an insulating layer which is stacked on the first wiring pattern so as to embed the component, and contains a reinforcing substance facing the component at a position on the opposite side to the side connecting to the first wiring pattern in the component; and a second wiring pattern, provided on the opposite side to the side where the first wiring pattern of this insulating layer exists. The connecting member contains particles of a first metal of which surfaces are coated with a plurality of element phases having a melting point of 260°C or higher; and a low-melting point metal having a melting point of 240°C or lower, and these plurality of element phases have a composition phase which is one composition of this low-melting point metal, and has a second metal having the melting point of 240°C or lower and the first metal, the plurality of element phases for each surface of the particles of the first metal are connected to each other, thereby forming a conductive skeleton structure, and a resin portion embedding a gap of the skeleton structure is further contained. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
