| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat generating device capable of improving heat conductivity between a heat radiation member and a heat sink, and reducing the manufacturing cost. SOLUTION: The heat generating device 3 includes: a semiconductor element 5, a heat sink 6 which releases heat upon receiving heat from the semiconductor element 5 and is sealed with a package 9 together with the semiconductor element 5 with part of the package exposed to the outside, and a heat radiation member 7 which is welded to an externally exposed section of the heat sink 6 and radiates heat upon receiving heat from the heat sink 6. COPYRIGHT: (C)2011,JPO&INPIT |
