| 摘要 |
PROBLEM TO BE SOLVED: To provide a means to improve waste radiation of a semiconductor mounted on a printed wiring board. SOLUTION: This semiconductor on a printed wiring board is moved to a different dimension, that is, the printed wiring board and a normal line of the semiconductor overlapping the printed wiring board are slightly shifted from each other. Wire bonding is carried out by multi-level crossing, or oblique attachment or ordinary attachment, and a chip is twisted and shifted on a usual printed board at the most effective angle with a margin imparted to a lead frame. The bonding wires in the semiconductor are multi-level crossed or shifted to prevent a short circuit, and are ordinarily attached. COPYRIGHT: (C)2011,JPO&INPIT
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