发明名称 SLURRY FOR CHEMICAL MECHANICAL POLISHING
摘要 The present invention relates to a slurry for chemical mechanical polishing, comprising an abrasive; an oxidant; an organic acid; and a polymeric additive comprising polyolefin-polyalkyleneoxide copolymer, wherein the polyolefin-polyalkyleneoxide copolymer comprises a polyolefin repeat unit and two or more polyalkyleneoxide repeat units, and at least one polyalkyleneoxide repeat unit is branched.
申请公布号 WO2010123300(A3) 申请公布日期 2011.03.31
申请号 WO2010KR02537 申请日期 2010.04.22
申请人 LG CHEM, LTD.;CHOI, EUN-MI;SHIN, DONG-MOK;CHO, SEUNG-BEOM 发明人 CHOI, EUN-MI;SHIN, DONG-MOK;CHO, SEUNG-BEOM
分类号 C09K3/14 主分类号 C09K3/14
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