发明名称 POLISHING APPARATUS AND POLISHING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing apparatus which prevents a substrate as an object to be polished, from coming off, and provides stable polishing. <P>SOLUTION: The polishing apparatus has: a polishing pad 101 having a polishing surface; a top ring body 2 that holds a substrate W and presses the substrate W against the polishing surface to polish the substrate; and a retainer ring 3 that holds an outer peripheral part of the substrate W and presses the polishing surface. The polishing apparatus is further equipped with: a sensor 506 that detects the height of the retainer ring 3 in at least two positions; and a computing unit 508 that computes the inclination of the retainer ring 3 from the height detected by the sensor 506. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011062812(A) 申请公布日期 2011.03.31
申请号 JP20100254656 申请日期 2010.11.15
申请人 EBARA CORP 发明人 YASUDA HOZUMI;TOGAWA TETSUJI;NABEYA OSAMU;SAITO KENICHIRO;FUKUSHIMA MAKOTO;INOUE TOMOMI
分类号 B24B37/04;B24B37/32;B24B49/10;H01L21/304 主分类号 B24B37/04
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