发明名称 METHOD OF MANUFACTURING WAFER-LEVEL LENS ARRAY, WAFER-LEVEL LENS ARRAY, LENS MODULE AND IMAGING UNIT
摘要 <P>PROBLEM TO BE SOLVED: To provide: a method of manufacturing a wafer-level lens array, the method preventing air from being mixed into a substrate part or a lens part to be molded when the wafer-level lens array having the substrate part and the lens part integrated with each other is molded; a wafer-level lens array; a lens module; and an imaging unit. <P>SOLUTION: In the method of manufacturing the wafer-level lens array, the wafer-level lens array having the substrate and a plurality of lens parts arranged on the substrate part is integrally molded by using a transfer mold, the transfer mold has a plurality of concave parts corresponding to at least the plurality of lens parts on the surface, a resin of an amount more than the volume of each of the plurality of concave parts is supplied to the concave part, the molding is performed in the state and, thereby, the resin overflowing from the concave parts is integrated to make the substrate part. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011064873(A) 申请公布日期 2011.03.31
申请号 JP20090214367 申请日期 2009.09.16
申请人 FUJIFILM CORP 发明人 YAMADA DAISUKE;SAKAKI TAKASHI
分类号 G02B3/00;B29C39/22;B29C39/24;B29C41/12;B29L11/00 主分类号 G02B3/00
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