| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To downsize a mounting board in which an electrostatic capacitive element is built by limiting the size thereof. <P>SOLUTION: A through opening part (through-hole TH) is formed in resin substrates (10, 13 and 16), a lower electrode 20 is formed covering an internal wall of the through opening part of the resin substrates, a dielectric film 21 is formed as a layer on the lower electrode, an upper electrode 23 is formed as a layer on the dielectric film, and wiring (31, 32) is formed on the resin substrates. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
