| 摘要 |
<p>PURPOSE: A multi-picker apparatus and a semiconductor device adhesion method using the same are provided to integrate control of a Z-axis coordinate system and aθaxis coordinate system by forming a z-axis driving part and aθaxis driving part together with. CONSTITUTION: In a multi-picker apparatus and a semiconductor device adhesion method using the same, a Z axis driving part(100) linearly moves a multi-picker apparatus around a Z coordinate system. Z axis driving part is comprised of a Z-axis motor(110), a Z-axis home sensor(120), a Z-axis dog bar(130), and a linear moving guide(150). AΘ-axis driving part is comprise of aθ-axis dog bar, aθ-axle spring, and aθ-axis motor(240) and rotates aθ-axis around aθ-coordinate system. A load cell measures the pressure applied to a semiconductor device.</p> |
