| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device for excellently connecting spherical solder enclosed with a resin to a terminal. <P>SOLUTION: The method of manufacturing the semiconductor device includes the processes of: forming a thermosetting resin film 8 containing an activator on a substrate 1, having a semiconductor element mounted on one surface and sealed with a resin, on the other side where a terminal 1b is exposed; bringing the spherical solder 9 into contact with the terminal 1b by pressing the spherical solder 9 against the thermosetting resin film 8; half-curing the thermosetting resin film 8 in a region coming into contact with the solder 9 by applying heat in a state wherein the solder 9 is pressed against the terminal 1b; removing the force pressing the solder 9 against the terminal 1b; connecting the solder 9 to the terminal 1b by fusing the solder 9 while heating the whole thermosetting resin film 8 to increase the curing rate of the thermosetting resin film 8; and lowering the temperature of the thermosetting resin film 8 and curing the solder 9. <P>COPYRIGHT: (C)2011,JPO&INPIT |
