| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermoplastic resin excellent in thermal conductivity that has high thermal conductivity as a resin itself without blended with a highly thermally conductive inorganic filler and enables injection molding even with a general-purpose mold for injection molding. <P>SOLUTION: In the thermoplastic resin, at least one diffraction peak by XRD measurement on the surface of the resin molded product is observed at 2θ=35-50°derived from the resin and having half width of 1°or less. The thermoplastic resin has the main chain comprising a repeating unit of a unit represented mainly by a mesogen group and a spacer, and preferably composed mainly of chain structure. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
