METHOD AND APPARATUS FOR CUTTING BRITTLE WORK

摘要

An apparatus for cutting brittle works is disclosed, and the apparatus is provided with: a CO2 laser oscillator (4) which emits laser beams (La, Lb); a scanning mechanism, which moves a liquid crystal display glass (W) and have the laser beams (La, Lb) travel over the surface of the liquid crystal display glass (W); and controllers (31, 32), which make the CO2 laser oscillator (4) and the scanning mechanism operate, cut the liquid crystal display glass (W) by having the laser beams (La, Lb) travel over the liquid crystal display glass, and remelt the cut surface by having the laser beam (Lb) travel again along the cut line (Wa) of the liquid crystal display glass (W) that has been cut by the laser beam scanning. The controllers (31, 32) control the beam diameter of the subsequent laser beam (Lb), which performs subsequent scanning, to be equivalent to or more than the beam diameter of the preceding laser beam (La), which performs preceding scanning, and control the power of the subsequent laser beam (Lb) to be equivalent to or lower than the power of the preceding laser beam (La). An operation time is shortened, the cut surface requiring almost no finish processing can be obtained, and a hole having no cracks on the inner corners can be formed at the time of machining a hole having the inner corners.