POLYMER THICK FILM SILVER ELECTRODE COMPOSITION FOR USE AS A PLATING LINK
摘要
<p>The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium comprising (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent. The invention is further directed to novel method(s) of circuitry formation on printed wiring board constructions.</p>
申请公布号
WO2011037836(A1)
申请公布日期
2011.03.31
申请号
WO2010US49289
申请日期
2010.09.17
申请人
E. I. DU PONT DE NEMOURS AND COMPANY;CRUMPTON, JOHN, C.;DORFMAN, JAY, ROBERT