发明名称 INSULATING FINE PARTICLE-COATED CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, AND ANISOTROPIC CONDUCTIVE MOLDING
摘要 PROBLEM TO BE SOLVED: To provide an insulating fine particle-coated conductive particles including insulating fine particles present on surfaces of conductive particles which expresses a high insulation by having a superior solvent resistance and a superior continuity by having an appropriate flexibility, an isotropic conductive adhesive composition including such an insulating fine particle-coated conductive particles, and an anisotropic conductive molding obtained from such insulating fine particle-coated conductive particles. SOLUTION: The insulating fine particle-coated conductive particles include organic and inorganic composite fine particles with an average particle size of ≤1 μm present on the surface of the conductive particles. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011065750(A) 申请公布日期 2011.03.31
申请号 JP20090212676 申请日期 2009.09.15
申请人 NIPPON SHOKUBAI CO LTD 发明人 SASAKI YOSHIKUNI
分类号 H01B5/00;H01B1/22;H01B5/16;H01R11/01 主分类号 H01B5/00
代理机构 代理人
主权项
地址