| 摘要 |
PROBLEM TO BE SOLVED: To realize electric inspection of a semiconductor integrated circuit having narrow-pitched test pads. SOLUTION: A semiconductor wafer is prepared, which is divided into a plurality of chip regions, has a semiconductor integrated circuit formed on each of the plurality of chip regions, and has a plurality of electrodes formed for being electrically connected with the semiconductor integrated circuit on a principal plane. A probe card having a plurality of contact terminals capable of contact with the plurality of electrodes is prepared. Meanwhile, a first sheet (2) is prepared, which includes the plurality of contact terminals (7) for being brought into contact with the plurality of electrodes, a second line electrically connected with the plurality of contact terminals and a first line, and an electric circuit formed in the vicinity of the plurality of contact terminals and composed of a passive element connected with the second line. Thereafter, the first sheet is attached to a wiring board so that a region where the plurality of contact terminals are formed can be pressed from the rear of the first sheet. COPYRIGHT: (C)2011,JPO&INPIT
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