LIQUID RESIN COMPOSITION FOR ELECTRONIC PART SEALING, AND ELECTRONIC PART APPARATUS UTILIZING THE SAME

摘要

LIQUID RESIN COMPOSITION FOR ELECTRONIC PART SEALING, AND ELECTRONIC PART APPARATUS UTILIZING THE SAME THE PRESENT INVENTION PROVIDES A LIQUID RESIN COMPOSITION FOR ELECTRONIC PART SEALING THAT IS GOOD IN FLUIDITY IN A NARROW GAP, BEING FREE FTOM VOID GENERATION, AND THAT EXCELS IN FILLET FORMATION, AND AN ELECTRONIC PART APPARATUS SEALED THEREBY OF HIGH RELIABILITY (MOISTURE RESISTANCE AND THERMAL SHOCK RESISTANCE). THE LIQUID RESIN COMPOSITION FOR ELECTRONIC PART SEALING IS CHARACTERIZED BY COMPRISING (A) AN EPOXY RESIN INCLUDING A LIQUID EPOXY RESIN, (B) A HARDENING AGENT INCLUDING A LIQUID AROMATIC AMINE, (C) A HYDRAZIDE COMPOUND HAVING AN AVERAGE PARTICLE DIAMETER OF LESS THAN 2 IT M, AND (D) AN INORGANIC FILLER HAVING AN AVERAGE PARTICLE DIAMETER OF LESS THAN 2 G M.