| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor circuit device capable of easily stabilizing electrical connection between the semiconductor circuit device and an external apparatus; and the like. <P>SOLUTION: This method of manufacturing a semiconductor circuit device includes: a semiconductor circuit formation process; a first removal process of removing a part of an insulation layer 140 surrounding a semiconductor circuit 160, dividing the insulation layer 140 into a first insulation part 140 in contact with the semiconductor circuit 160 and a second insulation part 140b separated from the first insulation part 140, and forming a side face of the second insulation part 140b on the semiconductor circuit 160 side into an inclined surface; a passivation layer formation process; a second removal process of removing a part of the second insulation part 140b and a part of the passivation layer 180 in a direction vertical to a substrate surface of a transfer source substrate 100; an adhesive hardening process of sticking the transfer source substrate 100 to a transfer destination substrate; and a peeling process of peeling the transfer source substrate 100 and the second insulation part 140b from the transfer destination substrate and the like. <P>COPYRIGHT: (C)2011,JPO&INPIT |
