| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor substrate, capable of achieving a high quality through type electrode in higher productivity at lower cost, even when the semiconductor substrate is thick. SOLUTION: An electrode pad (102) having an opening (104) including an exposed active surface is formed to a semiconductor substrate (101). A recess (105a) is formed toward the surface in the opposite side of the active surface from the opening (104). An insulating film (106) is formed at the internal side of the recess (105a). A conductive path (107) is formed on the surface of the insulating film (106) and the electrode pad (102). Thereafter, the semiconductor substrate (101) is formed thinner from the surface in the opposite side of the active surface and is then provided through the bottom of the recess (105a). COPYRIGHT: (C)2011,JPO&INPIT
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