| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein the load of a worker is large and work efficiency is low. SOLUTION: An acquisition unit 11 acquires a pattern image which represents a semiconductor pattern. An input unit 12 receives the field size of a drawing field and the width of the joint of the drawing field. A control unit 14 specifies the non-inspection region being the region on the semiconductor pattern corresponding to the joint on the basis of the field size and the width of the joint received by the input unit 12. An inspection unit 15 inspects at least the flaw in a final inspection region excepting the non-inspection region, which is specified by the control unit 14, from the semiconductor pattern using the pattern image acquired by the acquisition unit 11 and outputs final inspection results showing the flaw in the final inspection region. COPYRIGHT: (C)2011,JPO&INPIT
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