| 摘要 |
The invention relates to a semiconductor device having an integrated circuit die and a housing. The housing includes a base surface and at least one lateral surface which extends across to the base surface. In particular, this semiconductor device can be an electronic chip card, such as a universal integrated circuit card (UICC). The semiconductor device includes at least one electrical contact for electrically connecting the integrated circuit die with an abutting counter contact of a connecting device. The electrical contact has first and second mating sections, which are arranged on the base surface and lateral surface, respectively, and are connected to each other through a bent section.
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