| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a three-dimensional circuit board that can reduce the level difference of a gap between both end parts produced at both ends of a filmy circuit board when manufacturing the three-dimensional circuit board by sticking the filmy circuit board on a cylindrical body. <P>SOLUTION: The method of manufacturing the three-dimensional circuit board includes a first process of sticking a filmy adhesive 12 on the cylindrical body 11 while leaving a gap 12a between both end parts and a second process of sticking the filmy circuit board 13 on the filmy adhesive 12 so that a gap 13a between both the end parts does not overlap the gap 12a of the filmy adhesive 12, wherein the filmy adhesive 12 flows by application of pressing pressure during the sticking in the second process to backfill the gap 12a to form an adhesive layer having no gap, and at the same time, the adhesive is piled up at the gap 13a between both end parts of the filmy circuit board 13. <P>COPYRIGHT: (C)2011,JPO&INPIT |
