| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for processing films attached on two sides of a glass substrate, in particular, a method for processing films attached on two sides of the glass substrate by applying a kind of laser beam of low transmittance to films. <P>SOLUTION: In the method for processing films attached on two sides of the glass substrate, there is provided a laser machining device capable of projecting the laser beam whereas the transmittance of the laser beam is below 50%, and there is provided a glass substrate having its two sides being attached by films in respective. The laser machining device is excited for projecting the laser beam. The laser beam is applied onto the films attached on two sides of the glass substrate, and unnecessary portion of the films are etched or removed to form the films with predefined patterns on two sides of the glass substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
