| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat generating device apparatus capable of miniaturizing the entire unit and simplifying a component assembling work. SOLUTION: The heat generating device apparatus 1 includes: a heat generating device 3 having a semiconductor device 5 and a heat sink 6 sealed with a package 9 together with the semiconductor device 5 with a part thereof exposed to the outside; and a connector housing 23 formed by integrating the heat generating device 3 by insertion molding and having connector terminals 20, 22 welded to the semiconductor terminal 5 via a collector element 10 and an emitter terminal 12. COPYRIGHT: (C)2011,JPO&INPIT |
