发明名称 ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic component capable of connecting easily and electrically conductively between the terminals. SOLUTION: The electronic component is connected by a conductive composition or a thermal conductive composition containing respectively conductive particles and a binder between terminals mutually facing each other or between components requiring connection. The electronic component has a relative filling density of 68-90% in the conductive composition or the thermal conductive composition and makes connection between the terminals facing each other or between the components requiring connection through mainly silver fine powders contained in the conductive particles. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011065999(A) 申请公布日期 2011.03.31
申请号 JP20100216039 申请日期 2010.09.27
申请人 HITACHI CHEM CO LTD 发明人 KUWAJIMA HIDEJI
分类号 H01B1/22;B22F1/00;B22F1/02;C08K3/08;C08K9/02;C08L101/00;H01B1/00;H01L21/60;H01R11/01 主分类号 H01B1/22
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