发明名称 COMPONENT CRIMPING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a component crimping device that acquires data useful for analyzing the mechanism of such a change in relative position between a substrate and a component that occurs when the component is pressed down to a conductive tape. SOLUTION: The component crimping device has a beam splitter BS wherein at least part of a substrate contact section 24c in contact with a substrate PB of a substrate supporting stand 24 includes a reflection surface m for reflecting a light from the upper side in the horizontal direction in its inside, and it includes: an imaging camera 29 that, while the side edge Ed of the substrate PB is supported by the substrate supporting stand 24 and a crimping head 26 presses down the component P to a conductive tape DT located right above the beam splitter BS, picks up a changing state of relative position between the substrate PB and the component P, in the horizontal direction through the reflection surface m provided in the inside of the beam splitter BS; and a memory section Mr for storing image data that are acquired by the imaging camera 29 and shows the changing state of relative position between the substrate PB and the component P. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011066189(A) 申请公布日期 2011.03.31
申请号 JP20090215335 申请日期 2009.09.17
申请人 PANASONIC CORP 发明人 KAMEDA AKIRA
分类号 H01L21/603;G02F1/13;G02F1/1345 主分类号 H01L21/603
代理机构 代理人
主权项
地址