| 摘要 |
PROBLEM TO BE SOLVED: To reduce a manufacturing cost of a joint structure with metal pads and through-hole vias conducted. SOLUTION: A multilayer substrate 3 having pads 10b, formed at opening borders of through-holes 9, and a circuit board 5 having metal pads 7, with a base substrate 6 and solders 8, provided on the base substrate are provided. The joint structure is manufactured by irradiating heating beam 100 to the solders through the through-holes with the through-holes and the metal pads aligned to melt the solders, jointing the pads formed at the opening borders of the through-holes and the metal pads of the circuit board. COPYRIGHT: (C)2011,JPO&INPIT
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