WERKWIJZE EN INRICHTING VOOR HET VERVAARDIGEN VAN UIT DIAMANTLICHAAM BESTAANDE WARMTEGELEIDERS, ALSMEDE WARMTEGELEIDERS VERKREGEN MET DE WERKWIJZE

摘要

1278015 Severing D DRUKKER & ZN NV 13 March 1970 [13 March 1969] 12327/70 Heading B3D [Also in Division H1] Apparatus for sawing up slices cut from selected diamonds to form rectangular heat sink blocks for solid state devices includes a mounting member 8 to which the diamond slice 17 is removably secured, the mounting member 8 being adjustable between two mutually perpendicular positions to permit the diamond 17 to be sawn in both directions. A saw guide 14 situated above the mounted diamond 17 has a series of spaced slots 15 through which a diamond saw blade 16 may be successively inserted, clearance for the blade beneath the diamond 17 being provided by an array of slots in two mutually perpendicular directions in the upper face of the mounting member 8. A gang saw may alternatively be used, penetrating all the slots 15 simultaneously. Where it is desired to mount two or more devices on a single diamond heat sink, the slice 17 may be cut into larger pieces by only inserting the saw blade 16 into certain of the slots 15 and omitting other slots. The heat sink may be used for a transistor, Gunn diode, avalanche diode or solid state laser and preferably comprises a type IIa diamond block selected to have an infra-red transmission characteristic which remains substantially level or increases throughout the wavelength range from 7 to 8 Ám. Preferably the selected material also exhibits no internal strain variations extending over more than 0À1 mm as determined by birefringence. Diamonds thus selected are stated to have a particularly high and uniform thermal conductivity.